Numerical Analysis of Single-Phase Heat Transfer on Micro Pin Fin Arrays for Liquid Electronic Cooling Application

dc.contributor.advisorManteufel, Randall D.
dc.contributor.authorRamachandran, Dinesh
dc.contributor.committeeMemberFeng, Zhi-Gang
dc.contributor.committeeMemberKarimi, Amir
dc.date.accessioned2024-02-12T19:52:24Z
dc.date.available2024-02-12T19:52:24Z
dc.date.issued2018
dc.descriptionThis item is available only to currently enrolled UTSA students, faculty or staff. To download, navigate to Log In in the top right-hand corner of this screen, then select Log in with my UTSA ID.
dc.description.abstractWith miniaturization of electronic components, the need for heat dissipation becomes a crucial factor for system performance. Pin fin heat sinks with liquid cooling have become an effective choice for cooling microelectronic packages. A numerical study of heat transfer and pressure drop characteristics was performed over three staggered arrays of micro-pin fins for a single-phase laminar fluid flow condition. Three fins modeled were, circular, elliptical and hydrofoil having the same solid fraction and constant pitch to width ratio. A heat sink with 0.14 times 10 mm2 footprint was modeled choosing staggered hydrofoil array with 280µm chord length and 110µm foil thickness as the basis of comparison. Symmetry conditions were adopted parallel to the fluid flow and assumption is validated as the H/L ratio is less than 1 nullifying the effect of end walls on the modeled problem. Validating the numerical model over experimental results from literature, correlations were developed for Nusselt number and friction factor as a function of Reynolds number. The average Nusselt number for finned structure was found to be 2.5 to 3.5 times higher than the conventional parallel plate structure. Average heat transfer coefficient for hydrofoil and elliptical fin showed an improvement of 8.5% and 5.7% respectively over circular fin at high-pressure drop range. Average friction factor for hydrofoil and elliptical fins were 53% and 44% lower to circular fin respectively. Hydrofoil was concluded as the best configuration for thermal performance at a specific pressure drop and pumping power showing streamlined flow throughout the range of Reynolds number modeled.
dc.description.departmentMechanical Engineering
dc.format.extent89 pages
dc.format.mimetypeapplication/pdf
dc.identifier.urihttps://hdl.handle.net/20.500.12588/5211
dc.languageen
dc.subjectliquid electronic cooling
dc.subjectmicro fins
dc.subjectnumerical simulation
dc.subjectpin fins
dc.subject.classificationMechanical engineering
dc.subject.classificationThermodynamics
dc.subject.classificationFluid mechanics
dc.titleNumerical Analysis of Single-Phase Heat Transfer on Micro Pin Fin Arrays for Liquid Electronic Cooling Application
dc.typeThesis
dc.type.dcmiText
dcterms.accessRightspq_closed
thesis.degree.departmentMechanical Engineering
thesis.degree.grantorUniversity of Texas at San Antonio
thesis.degree.levelMasters
thesis.degree.nameMaster of Science

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