Computationally Informed Adhesion Measurement Using the Blister Test

dc.contributor.advisorRincon Troconis, Brendy C.
dc.contributor.advisorRestrepo, David
dc.contributor.authorDahal, Drishya
dc.contributor.committeeMemberMontoya, Arturo
dc.date.accessioned2024-04-08T16:00:32Z
dc.date.available2024-05-25
dc.date.available2024-04-08T16:00:32Z
dc.date.issued2023
dc.descriptionThis item is available only to currently enrolled UTSA students, faculty or staff. To download, navigate to Log In in the top right-hand corner of this screen, then select Log in with my UTSA ID.
dc.description.abstractThe adhesion of thin films is crucial in several engineering fields, ranging from corrosion protection through coatings to structurally bonding dissimilar materials in the aerospace and automotive sectors. The effectiveness of these films highly depends on their adhesion to rigid substrates. Therefore, investigating the adhesion mechanics between thin films and rigid substrates is an essential research area with significant implications for commercial sectors and scientific understanding. However, quantifying the adhesion strength is a complex task. While many different adhesion tests are available, the Blister Test (BT) has been identified as a superior method for adhesion quantification. In this test, the substrate-coating interface is pressurized and allowed to debond, enabling the quantification of the energies required to initiate and delaminate the film. The first chapter of this thesis presents a novel method to characterize the mechanical mix-mode adhesion characteristics between thin films and rigid substrates using the BT. This method couples the full triaxial displacement field obtained though Digital Image Correlation (DIC) with Finite Element Method (FEM) simulations, eliminating the need to assume blister shapes or make other mechanistic assumptions. The proposed technique allows the characterization of the full traction-separation law governing the adhering layer-substrate interface. In the second chapter, effects of surface treatment on adhesion is investigated for aluminum alloys adhered to Polyvinyl Butyral (PVB) and a Betamate 4601 epoxy adhesive. This adhesion assessments are performed using the BT, cross-hatch test, and filiform corrosion experiments. Further evaluations included adhesion measurement after exposure to relative humidity cycle and salt solution immersions.
dc.description.departmentMechanical Engineering
dc.format.extent87 pages
dc.format.mimetypeapplication/pdf
dc.identifier.urihttps://hdl.handle.net/20.500.12588/6343
dc.language.isoen
dc.subjectBlister Test
dc.subjectcohesive element (CZM)
dc.subjectDigital Image Correlation (DIC)
dc.subjectinverse finite element
dc.subjectPPR cohesive element
dc.subject.classificationMechanical engineering
dc.titleComputationally Informed Adhesion Measurement Using the Blister Test
dc.typeThesis
dc.type.dcmiText
dcterms.accessRightspq_closed
local.embargo.terms2024-05-25
thesis.degree.departmentMechanical Engineering
thesis.degree.grantorUniversity of Texas at San Antonio
thesis.degree.levelMasters
thesis.degree.nameMaster of Science

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